Technology · Semiconductor fab and packaging
Who’s working on semiconductor fab and packaging?
Chip progress now comes from packaging as much as from transistors: hybrid bonding, through-silicon vias, chiplets and interposers, alongside the process work in the fab. This page shows how much of that work the Helikon Research Graph holds and gives you a problem statement to run in Partner Search.
What the Helikon Research Graph holds on semiconductor fab and packaging
8,200+
researchers
11,000+
publications
34,000+
U.S. patents
Counts from the Helikon Research Graph on 9 October 2026; rounded down. Each figure is counted on its own, so they are not added together.
How these were counted
- Publications: papers whose title, author names or research topics match the keyword set below, the same text the Literature search reads.
- U.S. patents: granted U.S. patents whose text matches the keyword set and that carry at least one of these CPC subclasses: H01L, H10B, H10D, B23K. That is the Patents search with the CPC subclass field set.
- Researchers: people in the graph who authored a matching publication or are named inventors on a matching patent.
- Keyword set:
"semiconductor packaging" OR "advanced packaging" OR "hybrid bonding" OR "through-silicon via" OR "through silicon via" OR "chiplet" OR "heterogeneous integration" OR "3D integration" OR "wafer bonding" OR "silicon interposer" OR "flip chip" OR "semiconductor fabrication" OR "semiconductor manufacturing"
Try it on a real problem
Partner Search ranks researchers against a problem statement by what their publications, patents and profiles say. This one is ready to run; edit it to fit your project.
We're moving die stacks from microbumps to hybrid bonding and need Cu–Cu bonds that form at lower anneal temperatures with fewer voids. Looking for a group with interface characterization and reliability testing.Run this in Partner Search
Who’s working on this
Electrical engineering, materials science and physics groups at universities, national laboratory microelectronics programs, and company teams in fabrication, packaging and equipment.
WalkthroughMap a technology area: who publishes, who patents, and what innovation builds onSearch the whole graph on the Free plan.